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Xbox 360 'Slim' coming?

Written by Andre Yoskowitz @ 16 Mar 2010 10:02 User comments (19)

Xbox 360 'Slim' coming? VGChartz has posted an interesting and speculative report this week, implying that Microsoft may be creating an Xbox 360 "Slim," a redesign that will shrink the size of the original console and mark the first major complete redesign since the console's launch in 2005.
Microsoft is hiring a new motherboard engineer, one for the 360 development team, with the job ad going up last week.

CEO Steve Ballmer, known for letting speculative comments fly almost every time he speaks, started the rumor mill last week as well, saying new console models would be available in the future with different "form factors."

Here is the full job ad (and let the speculation begin):

Job Category: Hardware Engineering
Location: United States, CA, Mountain View
Job ID: 714897
Product: Xbox Home
Division: Entertainment & Devices Division



Motherboard Design Engineer
Job Description
The Xbox 360 Console development team is seeking qualified candidates for an Electrical Engineer. The responsibilities of this position are focused on specifying, designing (schematic capture, PCB layout, BOM, cost analysis), implementing and verifying the mother-board and other various sub-system boards that make up the XBOX 360 product line. This work includes development of requirements and evaluating different solution for functionality, cost, and risk. The subsystems on the XBOX 360 mother board include (but are not limited to): High speed busses (front side bus, memory bus, PCIe bus, SATA bus, USB bus, I2S, etc.), memory, Ethernet, audio/video, system clocking, power and thermal management, and misc. analog/digital circuitry.
The XBOX 360 Console Development team is responsible for aggressive cost reduction of the console throughout the life of the product as well as expanding the market for the console in derivative products. The position involves working closely with industrial designers, electrical engineers, mechanical engineers, software engineers, test engineers, component engineers, and program managers.

Qualifications:
Minimum BS/MS in Electrical Engineering
Minimum of 4 years experience contributing to the design and production of complex products in the consumer PC or consumer electronic industry.
A solid understanding of core engineering principles, fundamental circuit design, and analytical techniques is required.
Familiarity with PC, embedded system architectures hardware and software, experience with implementation of high speed serial busses (SATA, PCIe, USB) and/or high speed parallel busses such as: memory bus (DDR2, GDDR3, etc.), CPU front side bus, Hyper transport, and/or voltage regulator/power delivery design a plus.
Design for manufacturing and test experience is required.
Strong bench evaluation and in-lab debugging skills are required.
Strong communication skills required. Including the ability to clearly express technical concepts in verbal and written forms.
Must be able to plan work, and work to a plan adapting as necessary in a rapidly evolving environment.
The ability to comprehend and assimilate technical concepts across multiple disciplines is a plus.
Enthusiastic, motivated and self driven.
Domestic and international travel may be required.

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19 user comments

116.3.2010 22:26

Is this a ploy to get people to update to a slimmer model? Will it still have the problems of RROD, and I feel that the unit will be sealed so that the only way of opening it will be to destroy it in the opening process. Possibly a use until becomes inoperative, then throw it away. Just my thoughts.

216.3.2010 22:52

I have a bad feeling about this being packaged with natal at some point in time.

316.3.2010 23:17

Originally posted by bmlshane:
Is this a ploy to get people to update to a slimmer model? Will it still have the problems of RROD, and I feel that the unit will be sealed so that the only way of opening it will be to destroy it in the opening process. Possibly a use until becomes inoperative, then throw it away. Just my thoughts.
The "Slim" unit, if they are truly redesigning the system, isn't going to have the same massive problem the XBox 360 is constantly being put down for.

Since MicroSoft is redesigning the MoBo (and possibly other components) they are more than likely going to have it throughly tested and verified so they avoid another fiasco like with the original 360s.

417.3.2010 00:11

Please God not another console version. What makes this one, number 6?

517.3.2010 01:37

Originally posted by mike.m:
Please God not another console version. What makes this one, number 6?
If you mean hardware revisions then yes, this would be the sixth unless the Slim XBox 360 is not Valhalla. If the "Slim" is a different chipset than Valhalla then it would be revision 7.

617.3.2010 07:57

Sony come out with a slim no problem.M$ hint at one and the anti M$ BS start.

717.3.2010 10:38

Sony come out with a slim no problem.M$ hint at one and the anti M$ BS start.

I posted on the $ony slim some time back, with a lot of problems they had with the PS# console, and having to reflux them, and cooling problems etc, and M$ doing the same, it is obvious they are trying to get people to "Upgrade to a "better" console, one without all the problems of the original. If it were a Motor Vehicle, that caused so many problems, there would be such a public outcry, just like the toycar, with it's dangerous problem with sudden acceleration, and braking doesn't stop it. No recall or offer to fix by $ony or M$, so you can see my point of view.

817.3.2010 11:17

they cant even get the first one right, they have no buisness redesigning the 360, you can polish a terd but in the end its still a terd,

917.3.2010 12:34

Lol, weren't they flaming Sony for pulling crappy tactics to boost PS3 sales or that Sony are wasting their time re-designing the PS3 or something?

If this is true, then MS suck.

1017.3.2010 12:37

Originally posted by Se7ven:
Sony come out with a slim no problem.M$ hint at one and the anti M$ BS start.
its ironic that you use "M$" and complain about people bashing MS.

heres a couple of shots if anyone wants to see:

http://www.engadget.com/2010/03/17/xbox-...-chinese-forum/

1117.3.2010 20:04

i dont see why this is bad?
I personally thing that this a good move from MS.

In theory,
1st It will be cheaper.
2nd It shows that MS will keep 360 longer than it was expected.
3rd It will make less noise.
4th Will not suffer from RROD.
5th It will consume less power.

and fgs people, sony didn't came up with the slim PS3 cause the fat had issues, but to lower the production cost.
All PS models end up with a slim version
|PSX>>PS1| |PS2>>PS2 Slim| |PS3>>PS3 Slim|

1218.3.2010 14:56

@SDF_GR

Bravo, first sensible post.

N.B. Thanks for the link shaffaaf.

This message has been edited since its posting. Latest edit was made on 18 Mar 2010 @ 3:00

1318.3.2010 22:05

@ Jemborg
appreciated

1419.3.2010 02:00

Why don't they address the RROD issue first before they move out with a slim model

1519.3.2010 02:09

Originally posted by TBandit:
Why don't they address the RROD issue first before they move out with a slim model
Jasper has greatly reduced the RRoD. It's still probably a bit higher than the PS3's failure rate but it's definitely not at the previous levels.

Also, if they are truly designing a new Motherboard for the "Slim" model it shouldn't have the RRoD problem since Microsoft knows what is causing the majority of them and would (hopefully) find a way to eliminate it with the use of a new motherboard.

1619.3.2010 02:15

Originally posted by TBandit:
Why don't they address the RROD issue first before they move out with a slim model
@TBandit

Bravo, least sensible post.

:D
This message has been edited since its posting. Latest edit was made on 19 Mar 2010 @ 2:16

1719.3.2010 06:19

well roumered is that both the gpu and cpu will be at 45nm, a big difference from the 65nm CPU and 80nm GPU. Should reduce power and heat and therefore most likely reduce the RROD. Heres hoping the cooling it adequaint.

and no problem about the link.

This message has been edited since its posting. Latest edit was made on 19 Mar 2010 @ 6:20

1819.3.2010 15:32

Just wait to see the slim model .I think that CPI and GPU integration is going to be real
CPU and GPU on single die45nm:
Before:
http://67.206.223.5/img.hexus.net/v2/gam...60-valhalla.jpg
After:
http://67.206.223.6/img.hexus.net/v2/gam...lhalla-chip.jpg
=
http://67.206.223.7/www.blogdegeek.com/w...8-xboxslim1.jpg

This message has been edited since its posting. Latest edit was made on 19 Mar 2010 @ 3:36

1922.3.2010 22:33

Micro$oft really busy in keeping it's customer on check through upgrades and updates. $$$$$$$$$$$$$$$$

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